Ph.D. Candidate in Communication Engineering at
National Taiwan University, focusing on cryogenic RF measurement systems, sub-THz characterization, and RF hardware for quantum and cryogenic applications.
CMOS / GaAsIC design, tapeout, and characterization
Professional Summary
Ph.D. candidate in Communication Engineering with 8+ years of hands-on experience in cryogenic RF measurement systems, sub-THz characterization, antenna and RF front-end development, and CMOS/GaAs IC tapeout. Built 67 GHz RF test setups, developed cryogenic calibration methods, and supported hardware integration for RF and quantum-related applications.
Education
Sep 2019 – Present
National Taiwan University
Ph.D. Candidate, Communication Engineering · Taipei, Taiwan
Direct transition from M.S. program, entered Feb 2018; M.S. degree not separately conferred.
Advisor: Dr. Shih-Yuan Chen
Research Topic:Integration and Characterization of Control and Readout RF Circuitries for Quantum and Cryogenic Applications
Award: 2020 iWEM Conference Best Paper Award
Teaching Assistant: Antenna Course, Fall 2025
2012 – 2016
University of Michigan – Ann Arbor
Bachelor of Science in Mechanical Engineering · Ann Arbor, Michigan, USA
University of Michigan Dean's List; University of Michigan Honors, Winter 2015
Select RF System Projects
Research, measurement, and hardware integration
2022 – 2026
Cryogenic Measurements
System Setup · NTU GICE
Designed an 18 GHz cryogenic RF signal chain and fabricated Rogers RO3003 PCB sample holders for dilution refrigerator measurements from 10 mK–300 K, accounting for high-frequency routing and stable Dk.
Developed mK cryogenic TRL calibration procedures for RF measurements in a dilution refrigerator, including the effects of cable loss, temperature dependence, and limited in-situ standards.
Configured a DC–67 GHz, 4-K probe station and selected instrumentation and components for low-temperature IC and device characterization.
Cryogenic RFTRL calibration67 GHz probing
2025, 2020
sub-THz System
Design and Measurement · NTU GICE
Designed the RF system for a 150 GHz transmittive microwave imaging system to measure a 61 × 61 grid.
Measured S-parameters of a 170 GHz patch antenna using a D-band state-of-the-art probe antenna system.
2020
IC Design
Design and Tapeout · NTU GICE
Taped out a 28-bit Serial-Peripheral Interface IC for bias voltage control using 0.18 µm CMOS.
Taped out a 29 GHz 1 W GaAs PA using 0.15 µm pHEMT Technology for SATCOM applications.
Taped out a 29 GHz IQ Up-Converter using 0.18 µm CMOS Technology.
2018
Ka-band SATCOM Project with KACST
TRx System Integration · NTU GICE
Characterized individual Tx/Rx RFIC building blocks, including up/down-conversion, phase shifting, buffering, PA/LNA stages, and antenna-array interfaces.
Coordinated subsystem integration across multiple labs to assemble and validate the end-to-end TRx chain.
Performed module- and system-level testing to verify combined transmitter/receiver operation.
2018
Falcon Tracking Project
Long Range Transceiver Design and Fabrication · NTU GICE
Designed transmitter and receiver systems for long-range GPS wireless transmission.
Created an Android app written in React Native to display GPS data and compass direction.
Designed and fabricated cases for modules and housing using SolidWorks.
Work Experience
Sep 2016 – Aug 2017
Extol
Design Engineer · Holland, Michigan, USA
Led the mechanical design of integration packages for infrared plastic staking machines, utilizing SolidWorks for component modeling and assembly.
May 2014 – Aug 2014
Exosite
Testing Intern · Taichung, Taiwan
Developed JavaScript/Selenium browser-automation scripts to test, debug, and validate customer web portals.
May 2013 – Aug 2013
National Taiwan University
Research Assistant · Taipei, Taiwan
Experimented with the heat transfer and dissipation of satellite IC chips at different power outputs.
Analyzed the optimization of heat dissipation required to satisfy specifications.
H.-P. Liao, I. Huang, and S.-Y. Chen, “An ultra-lightweight wideband folded E-shaped patch antenna made from aluminum meshes for high-power S-band applications,” IEEE Transactions on Antennas and Propagation, 2025.
Y.-C. Chang, I. Huang, C.-Y. Chen, M.-J. Lin, S.-Y. Chen, and J.-Y. Li, “Electron-spin-resonance meanderlines for effective spin control in Si quantum dots for large-scale qubit applications,” Applied Physics Letters, vol. 119, no. 24, Art. no. 243503, 2021.
J. Y.-C. Liu, I. Huang, Y.-H. Kuo, W.-T. Li, W.-H. Lin, W.-J. Lin, J.-H. Tsai, H. Alsuraisry, H.-C. Lu, and T.-W. Huang, “Smart RF integrated circuits: A millimeter-wave gigabit transceiver with digitally-enabled built-in self-healing and auto-switching functions,” IEEE Microwave Magazine, vol. 20, no. 1, pp. 28–37, 2018.
Conferences
S.-W. Wu, I. Huang, R. Jeanty, Z.-H. Fu, K.-Y. Lin, and S.-Y. Chen, “A miniaturized microstrip-based phase inverter as a phase delay component at 24 GHz,” in Proc. 2024 Int. Symp. on Antennas and Propagation (ISAP), pp. 1–2, 2024.
S.-Y. Chen, I. Huang, M.-J. Lin, J.-Y. Li, and S.-Y. Chen, “A DC to 67-GHz 40-nm CMOS SP4T switch for cryogenic S-parameter measurement and calibration,” in Proc. 2024 19th European Microwave Integrated Circuits Conf. (EuMIC), pp. 206–209, 2024.
Y.-T. Chen, I. Huang, M.-J. Lin, S.-Y. Chuang, H.-L. Ho, K.-S. Hsu, P.-Y. Lin, S.-Y. Chen, L.-H. Lu, and S.-Y. Chen, “A thru-reflect-series-resistance (TRS) calibration for cryogenic device characterization in 40-nm CMOS technology,” in Proc. 2023 IEEE/MTT-S Int. Microwave Symp. (IMS), pp. 1203–1206, 2023.
I. Huang, L.-Y. Kung, and S.-Y. Chen, “Multi-layered proximity probe-fed E-shaped patch antenna array for terahertz imaging system,” in Proc. 2023 17th European Conf. on Antennas and Propagation (EuCAP), pp. 1–5, 2023.
I. Huang, C.-L. Liao, and S.-Y. Chen, “Dual-linearly-polarized printed dual-dipole antenna array for polarimetric radar application,” in Proc. 2020 Int. Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), pp. 1–2, 2020.
H. Alsuraisry, W.-J. Lin, I. Huang, and T.-W. Huang, “Design of Ka-band transceiver for satellite communication,” in Proc. 2019 IEEE Jordan Int. Joint Conf. Electr. Eng. Inf. Technol. (JEEIT), pp. 307–310, 2019.
K.-C. Chiang, T.-C. Tsai, I. Huang, J.-H. Tsai, and T.-W. Huang, “A 27-GHz transformer based power amplifier with 513.8-mW/mm² output power density and 40.7% peak PAE in 1-V 28-nm CMOS,” in Proc. 2019 IEEE MTT-S Int. Microwave Symp. (IMS), pp. 1283–1286, 2019.
I. Huang, Y.-C. Li, W.-C. Lin, J.-H. Tsai, A. Alshehri, M. Almalki, A. Sayed, H.-C. Lu, and T.-W. Huang, “Reviews of high image rejection up and down converters for next-generation satellite applications,” in Proc. 2018 IEEE Int. Symp. Radio-Frequency Integration Technol. (RFIT), pp. 1–3, 2018.
T.-C. Tsai, I. Huang, J.-H. Tsai, A. Alshehri, M. Almalki, A. Sayed, and T.-W. Huang, “A Ka-band sub-harmonically pumped mixer using diode-connected MOSFET for 5G mm-wave transceivers,” in Proc. 2018 Asia-Pacific Microwave Conf. (APMC), pp. 488–490, 2018.
I. Huang, S.-T. Yen, W.-P. Chao, J.-H. Tsai, A. Alshehri, M. Almalki, A. Sayed, and T.-W. Huang, “A 29.6 dBm 29-GHz power amplifier for satellite and 5G communications using 0.15-µm GaAs p-HEMT technology,” in Proc. 2018 Asia-Pacific Microwave Conf. (APMC), pp. 986–988, 2018.
Patent
J.-Y. Li, S.-Y. Chen, Y.-C. Chang, I. Huang, and C.-Y. Chen, “Electronic device with conductive resonator,” U.S. Patent App. 18/443,839, Jun. 6, 2024.